SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Charger l'image dans la visionneuse de la galerie, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ

Marque: Sunshine

Code produit: 2101320

Disponibilité:50 les pièces restantes (stock faible) seront expédiées dans les 24 heures

$57.70 - $58.70
$57.70 57.70

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